The Solderless Breadboard 400 Tie Points is a compact half-size prototyping board for quickly building and testing electronic circuits without soldering. Ideal for Arduino, Raspberry Pi, ESP32, sensor modules, IC experiments and classroom labs, it offers 300 terminal points plus 100 power-rail points for neat wiring. Reusable spring contacts accept standard jumper wires and DIP ICs, making it a practical choice for students, makers, repair technicians and electronics developers.

Colour: White body with red/blue power rail markings Layout: Half-size breadboard with central IC channel and side power rails Mounting: Self-adhesive backing Hole Pitch: 2.54 mm standard spacing Tie Points: 400 total Contact Type: Reusable spring contacts Product Type: Solderless prototyping breadboard Recommended Use: Low-voltage electronic circuit prototyping Power Rail Points: 100 points Soldering Required: No Typical Dimensions: Approx. 82 mm x 55 mm x 8.5 mm Compatible Wire Size: Typically 20 to 29 AWG solid wire; 22 AWG recommended Terminal Strip Points: 300 points Compatible IC Packages: Standard DIP ICs and through-hole components with 2.54 mm pitch

